Zastosowanie chłodzenia cieczą IGBT

   IGBT to podstawowe urządzenie przetwarzania i transmisji energii, powszechnie znane jako „procesor” urządzeń energoelektronicznych. Jako strategiczna wschodząca branża krajowa, IGBT jest szeroko stosowana w dziedzinie tranzytu kolejowego, inteligentnych sieci, lotnictwa, pojazdów elektrycznych i nowego sprzętu energetycznego.

     In most cases, the current flowing through the IGBT module is large and the switching frequency is very high, resulting in large loss of IGBT module devices, which makes the device temperature too high, and poor heat dissipation of IGBT module will cause damage and affect the operation of the whole machine. IGBT overheating may be caused by poor driving waveform, excessive current or high switching frequency, or poor heat dissipation.

       If the temperature is too high, the working efficiency of the module will decrease, which will affect the whole system. Especially for those equipment that need continuous operation, they rely more on IGBT module and need a good thermal performance system to ensure. The most commonly used are passive fin heat dissipation and air-cooled heat dissipation. These heat dissipation methods have low cost, convenient use and wide application. However, there are many constraints. The heat accumulation is too large to be dissipated in time, and the heat dissipation effect will soon reach the bottleneck. In this case, the IGBT module is facing great difficulties.

     In this case, the new thermal solution is bound to replace the traditional heat dissipation mode. As a fast developing way, liquid cooling has been outstanding in the field of heat dissipation in recent years. In recent years, Sinda thermal has been providing efficient and stable liquid-cooled plate heasink for cooperative customers in the field of IGBT to solve the heat dissipation problem of their IGBT module.